EVENT

Lasers in Action @ LASYS 2018 - Day 1

05 June 2018
Messe Stuttgart, Germany

The Lasers in Action Forum takes place over three days at LASYS, Messe Stuttgart, from 5-7 June. Entry to the forum is free of charge to any LASYS visitor.

Lasers in Action is organised by Laser Systems Europe on behalf of Messe Stuttgart.

DAY 1 - Tuesday 5 June

10.00-10.30

Laser surface heat treatment with dynamic optics

Juan Isaza, Talens Systems

Laser heat treatment (e.g. hardening) is becoming a widely used process for tailored improved mechanical properties of selected surfaces. The high energy density of the laser enables high rate temperature changes of the treated area. The process is flexible, clean and susceptible of automatization to control quality. The developed methodology could be directly applicable to other relevant hardenable materials and geometries, and find applications in other laser processes such as coating, welding, remelting and alloying.

www.talenssys.com

10.30-11.00

Advanced 3D laser processing/marking of free-form, surfaces with Coherent Visual Laser Marker Software

Daniel Seitz, Coherent-Rofin

The demand for laser marking of non-flat work pieces in the field of industrial laser applications is increasing rapidly. Coherent’s answer to meet market requirements is the continuous improvement and development of hard- and software solutions for 3D laser processing. During the presentation, common issues of free-form surface marking will be addressed, Coherent’s intuitive and easy to use editor software will be demonstrated and cost-efficient hardware solutions for manufacturing environments will be presented.

www.coherent.com

www.rofin.com

11.00-11.30

From the one stop solution to the one button solution - enabling cladding processes for I4.0

Dr Denise Beitelschmidt, Fraunhofer IWS Dresden

Laser cladding has been a major focus of research at Fraunhofer IWS for nearly two decades. Customised modification of system technologies, full system integration, as well as qualification of processes for different materials with regard to wear, corrosion, and thermal protection, has been provided to SMEs and large industrial partners ever since. Nowadays, the demand for products ready to be included in digital value chains is increasingly required in order to accomplish highly automated and self-optimising processes. The requirements towards these demands are going to be presented and process related solutions will be depicted.

www.iws.fraunhofer.de

11.30-12.00

Fast and precise laser contact opening of PERC solar cells using smart digital galvanometer scanning

John Hsu, Cambridge Technology

Passivated emitter and rear contact (PERC) has been widely recognised by the photovoltaic industry as the technology that enables >20 per cent cell energy conversion efficiency in production. Laser contact opening (LCO) is a key step in PERC, which creates contact openings in the rear passivation layer using laser ablation. This laser process is required to achieve extremely high throughput (>3,600 wafers/hour) and maintain continuous stability for volume production. Patterning accuracy of <20µm is typically required for high cell efficiency. While high speed galvanometer scanners are used for throughput, most OEMs also integrate acousto-optic modulators (AOMs) for the precise laser control needed to achieve the required patterning accuracy.

www.cambridgetechnology.com

12.00-12.30

Optical design of beam delivery systems for CW and pulsed lasers

Roberto Knoth, LightTrans International

The layout of a beam-delivery or beam-forming optical system consists of a number of different optical elements to predict the beam profile at desired locations. Our fast physical optics engine facilitates the fast and accurate propagation of laser beams through any kind of optical element, taking physical-optics effects like diffraction, polarisation and coherence into account. Specifically, the design and the analysis of high-numerical-aperture optics require fast and adequate propagation engines to generate small intense focal spots by inverse design and optimisation techniques.

www.lighttrans.com

12.30-13.00

Laser micromachining systems for the industrial production of electronic components

Hendrik Steinmetz, 3D-Micromac

In the industrial manufacturing of electronic components, precision, machining quality, throughput and costs are playing an important role. 3D-Micromacs presentation will give a brief overview of different production solutions where laser processing achieve new dimensions in terms of precision, quality and process efficiency. Innovative laser micro processes paired with sophisticated machining concepts fulfill exactly all the requirements for such sensitive and advanced devices.

http://3d-micromac.com

13.00-13.30

Beam deflection technologies for ultrashort pulse lasers

Holger Schlueter, Scanlab

Ultrashort pulse lasers require adequate scan systems to reveal the enormous potential for demanding applications. The XL Scan scanning solution extends a laser scan system‘s working field by simultaneously controlling a scan head, an XY-stage and a pulse-on-demand laser, thus delivering notable processing advantages, such as, synchronized motion and high processing throughput with an unprecedented level of accuracy of +/- 11 µm. The robust precSYS 5-axis scan system was created for industrial volume production via USP laser micromachining. The system enables fabrication of flexibly definable geometries and exceptionally accurate hole drilling.

http://www.scanlab.de

13.30-14.00

The potential of Optical Coherence Tomography (OCT) for industrial laser material processing – a practical view on the variety of applications

Daniel Schwab, Arges

OCT systems are employed in a wide variety of ways, as Daniel Schwab will explain in his presentation about the applications, opportunities and limitations of OCT technology. A special focus is based on the modular ARGES OCT system, which can be directly integrated in scan head solutions. This design enables the OCT technology to be used for in-process control while at the same time performing laser machining. The presentation concludes with a look at different applications and is of practical value to companies with a strong focus on process control solutions.

www.arges.de

14.00-14.30

Latest developments in system technology for laser beam hardening and laser beam generating

Dr Roland Dierken, Erlanger Lasertechnik

Hardening and cladding technologies should be feasible with one laser system. The key component of such systems is the laser working head, with its ability to be converted from a hardening system to a cladding system and vice versa as quickly and comfortably as possible. Currently, setting up, such as changing mirrors or docking and undocking of the powder feeding nozzle, is done manually. In order to minimise auxiliary process time, the experts of ERLAS Erlanger Lasertechnik have developed the next generation of laser working heads. Their main advantages in comparison to existing models are the possibilities of quick automatic switches between beam shapes and even processes.

www.erlas.de

14.30-15.00

Current trends in car body laser applications

Konstantin Ribalko, Laserline

For decades, the laser has already established itself as a vital tool in the production of car bodies. In 2018, the technology is still developing at an astonishing rate. With robust laser sources and flexible beam shaping technologies, Laserline offers effective solutions for the ever-arising challenges in the fields of brazing, aluminum welding and remote welding.

www.laserline.de

15.00-15.30

Advances in nsec UV laser applications

Scott White, MKS Spectra-Physics

DPSS nanosecond UV lasers are rapidly growing in a variety applications and industries, especially micro-electronics. As devices become more compact and power efficient, the benefits of processing with UV lasers becomes increasingly clear. In addition to small focus spot sizes and strong interaction of the UV wavelength in a wide variety of materials, ns UV DPSS lasers are becoming more attractive due to higher power at relatively low costs. This presentation highlights results using a high-power 45 W UV ns laser source, our new Talon 355-45, for PCB via drilling in copper/polyimide, cutting Flex PCBs, depaneling thick FR4, and micromachining ceramic materials.

www.spectra-physics.com

15.30-16.00

Novel green lasers revolutionise the cutting of polycrystalline diamonds

Christian Hahn, InnoLas Photonics

Free-form cutting and shaping of polycrystalline diamonds (PCD) used for diamond tools can be extremely challenging. Grinding techniques have been replaced by electrical discharging machining (EDM), providing much faster processing speeds but relatively poor cutting quality. The new approach using InnoLas Photonics 532nm high power, short pulse BLIZZ lasers provides highest cutting surface quality at high processing speed and allows arbitrary cutting shapes of PCD, piece-by-piece without additional tooling costs. This enables high speed PCD cutting processes with unparalleled quality even through challenging PCD carrier materials like tungsten carbide.

www.innolas-photonics.com

16.00-16.30

Fixtureless laser marking: The latest innovation in image processing applied to lasers
Faycal Benayad-Cherif, FOBA

FOBA is introducing a breakthrough innovation for its laser marking systems that dramatically reduces the need for tooling. A new software solution for automated vision-based mark alignment makes expensive part fixtures unnecessary. Even accidentally placed products get marked precisely due to automated laser positioning. The technical novelty represents substantial time and cost savings that manufacturers greatly welcome.

https://foba.com/

Day 2 >

Day 3 >

Messe Stuttgart / Europa Science

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