Featured exhibitor: 3D-Micromac

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Hall A2, Booth 129

Selective Laser Annealing System for Semiconductor, Power Device and MEMS Manufacturing

3D-Micromac will be exhibiting its new microPRO laser annealing system, designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, such as:

  • Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
  • Giant magneto resistive (GMR) and tunneling magneto resistive (TMR) sensor manufacturing
  • Dopant activation for insulated gate bipolar transistors (IGBTs), as well as activation of backside-illuminated CMOS image sensors.

The system combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor manufacturing platform and provides selective annealing in a versatile system.

The microPRO features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.

microPRO provides the following benefits:

  • High precision, repeatability and throughput
  • Excellent selectivity to different substrates and films
  • Very high energy homogeneity
  • Precise process monitoring 
  • Multiple options for pulse length, pulse energy and overlap

More information:

www.3d-micromac.com

Company: 

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