Laser Line Ultra system capable of machining incredibly precise microtools made from ultra-hard materials

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United Grinding and EWAG have together developed the Laser Line Ultra for machining the incredibly precise microtools required for applications in the electronics, medical and micromechanics industries.

The Laser Line Ultra uses an eight-axis configuration and picosecond lasers to machine complex micro geometries in cutting tools, regardless of the material’s hardness and with negligible heat-affected zones. It specialises in the laser fabrication of cutting tools made of hard and ultrahard materials such as tungsten carbide, polycrystalline diamond, chemical vapour deposition diamond and cubic boron nitride.

To ensure homogenous hole quality with micro-sized drill bits, wear-resistance of the tools is of utmost importance and can only be achieved by micro-cutting tools made out of ultrahard materials. By using ultrashort laser pulses and an EWAG drill module, the Laser Line Ultra enables diameter-to-length ratios up to 1:20. This technology allows manufacturers to produce tip thinning or chamfers, and unlike conventional techniques, the force-free process eliminates waste from tool breakage.

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22 February 2021