Semiconductors need to be inspected during every part of the manufacturing process for defects. Accurate and precise results are critical to prevent unnecessary product wastage and cost.
Resources
02 March 2021
For some years now, laser cutting processes based on filament technology with ultra-short pulse (USP) lasers have been increasingly adopted in industrial applications.
The main reasons for this are the good edge quality that can be achieved with simultaneous easy automation and free-form capability. This ability to be automated is of critical importance, especially for applications that target the mass market with their end products.
However, the real advantage of the technology comes from its almost unlimited free-form capability. In addition to established manufacturing processes for glasses of medium thickness from 0.2-2 mm, an increasing number of applications with ultra-thin glasses of 30-100μm are entering the market. These applications also require further development of the process and fab technology.
This article describes the possibilities of laser technology based on applications for OLED-based lighting and glass components in the display area.
08 September 2020
When purchasing a highly advanced device for use in the workplace, such as a laser, learning how to properly apply, troubleshoot, and evaluate that device becomes very important.
13 July 2020
Covered topics: Non-contact beam measurement; a precession bore system with a green laser for electronics fabrication; and laser cutting, welding and optical measurement for e-mobility production.
12 June 2020
Discussion topics including cladding with diode lasers, CO2 lasers in the automotive industry, nano-structured anti-reflective surfaces, and software for designing beam-splitting optics were covered in the second installment of the Lasers In Action Webinar series
