Israli firm Civan Lasers has announced its successful development of a 500W single-mode continuous-wave (SMCW) 532nm (green) laser – a world record for this type of laser, according to the firm.
The green laser was born out of the EUREKA project ‘CBC-Green’ – led by Fraunhofer IWS, Siemens, and Thyssenkrupp – which set out to create and implement a laser beam with high power for more flexible and efficient processing of copper materials.
How does the laser work and what are the benefits?
The 500W SMCW 532nm laser works by harnessing CBC technology, a technique which involves combining multiple lasers into a single coherent beam with exceptional beam quality.
By leveraging CBC, Civan Lasers’ system is able to attain high brightness without risking damage to a laser crystal (as is the case when increasing brightness using higher laser powers), thereby preserving the spectral properties of the beam and, ensuring longer-lasting and dependable performance over time.
The coherent beam combining functionality of the new green laser (Image: Civan Lasers)
It is this CBC technology that allows the laser to increase process efficiency and performance in material processing using a high-quality, high-power beam, while at the same time offering power modulation capabilities – a significant advancement given that 532nm lasers typically require stable crystal temperatures.
The capabilities hold potential for moving current practices past the limitations in processing copper, which occur due to the high degrees of reflectivity (compared to infrared fibre laser radiation, green lasers exhibit much more absorption in the material). The results would help industries to better process copper components that are key in the production of energy storage systems, power electronics, controls and the necessary cooling structures.
What are the next steps for the laser?
While development of the green SMCW laser is still ongoing, Civan Lasers have outlined its intent to make further progress, building on the promise shown across a range of diverse material processing applications. These include welding highly reflective materials such as copper, welding in the semiconductor domain – particularly chip-to-wafer welding, which could serve as an alternative to traditional wire bonding processes – and copper 3D printing.
For Civan Lasers, future development plans include cutting the laser’s size in half, dramatically lowering its cost, amplifying its power capabilities, and introducing a dynamic beam within the green laser – ultimately setting it apart from market competitors.
Following its development, the laser will be sent to Fraunhofer IWS. There, the institute will spearhead the development process for Siemens and Thyssenkrupp and further explore the laser's capabilities and potential applications, many of which are currently unknown as its researchers venture into uncharted territories.