Semiconductors need to be inspected during every part of the manufacturing process for defects. Accurate and precise results are critical to prevent unnecessary product wastage and cost.
White Papers
02 March 2021
For some years now, laser cutting processes based on filament technology with ultra-short pulse (USP) lasers have been increasingly adopted in industrial applications.
The main reasons for this are the good edge quality that can be achieved with simultaneous easy automation and free-form capability. This ability to be automated is of critical importance, especially for applications that target the mass market with their end products.
However, the real advantage of the technology comes from its almost unlimited free-form capability. In addition to established manufacturing processes for glasses of medium thickness from 0.2-2 mm, an increasing number of applications with ultra-thin glasses of 30-100μm are entering the market. These applications also require further development of the process and fab technology.
This article describes the possibilities of laser technology based on applications for OLED-based lighting and glass components in the display area.
08 September 2020
When purchasing a highly advanced device for use in the workplace, such as a laser, learning how to properly apply, troubleshoot, and evaluate that device becomes very important.
09 June 2020
Edmund Optics has developed nano-structured anti-reflective surfaces that can be used to reduce stray light in laser systems for materials processing.
05 July 2016
Modern ultra-short-pulse (USP) laser are enablers for the miniaturization of products or components in several sectors. This includes: Automotive, Aerospace, Textiles, Medical technology, Precision engineering etc.
In these markets typical applications for the lasers include: Drilling, Ablation, Structuring, Cutting.
Hole drilling in particular has become an important application in these industries. SCANLAB has introduced an innovative precession subsystem to the market that uses a novel 5-axis technology to incline the beam.
These five axes (x,y,z,α, β) maximize flexibility for process development beyond typical percussion drilling: e.g. spiral drilling, trepanning and precession drilling, which means the laser is tilted and moved helically.
