Drilling

Orbotech has introduced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations of electronic devices, including 5G smartphones, advanced automotive and medical devices. Orbotech's innovative roll-to-roll solutions for direct imaging (DI) and UV laser drilling overcome many of the yield, throughput and quality challenges inherent in flex material manufacturing.

The five-axis system allows engineers to cut, drill or machine complex shapes without the drawbacks associated with traditional laser machining such as heat build up or tapers

The new 250mm features an interchangeable, coated protective glass made of fused silica and advanced mounting technologies for a large telecentric scan field

The LASERDYNE 811 machine employs the most current hardware and software components for flexible precision laser processing in an affordable compact platform

The YLR-U series are high performance industrial-grade kilowatt-class continuous wave (CW) ytterbium fiber lasers

The new Jenoptik-Votan A Scan system is currently being set up and commissioned in Jena, Germany. Delivery will take place shortly before summer.