Electronics

Wafer Surface Analysis – Detecting the Defects with Laser Solutions

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Semiconductors need to be inspected during every part of the manufacturing process for defects. Accurate and precise results are critical to prevent unnecessary product wastage and cost. Within industrial, in-line applications, there are numerous challenges faced by customers and this paper looks at solutions to these challenges.

The micro loudspeaker proves that microactuators can be produced in seconds and at low costs using inkjet printers and lasers. (Image: Fraunhofer ILT)

Researchers print cost-effective micro loudspeaker

The process could be used as a faster and more affordable alternative to vacuum- and mask-based piezo-MEMS manufacturing methods

Orbotech introduces UV laser drilling machines for R2R flexible printed circuit manufacturing

Orbotech has introduced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations of electronic devices, including 5G smartphones, advanced automotive and medical devices. Orbotech's innovative roll-to-roll solutions for direct imaging (DI) and UV laser drilling overcome many of the yield, throughput and quality challenges inherent in flex material manufacturing.

The EUV source at Fraunhofer ILT’s Excimer facility delivers 40W at 13.5nm

EUV technology to become more accessible for SMEs

Keely Portway discovers how lasers are being used to advance Moore’s law, and how this technology is being made more affordable for smaller businesses

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