Process monitoring

(Lower left) A laser makes a hole in a material. (Upper left) The fluence of the laser is measured. (Lower right) Measurements of the fluence and the hole depth are superimposed. (Upper right) The relationship between these measurements is then determined so that hole depth can be calculated based solely on the fluence. (Image: Sakurai et al.)

Researchers devise low-cost process monitoring technique

The method was developed using a laser microscope and a Raspberry Pi Camera

Wafer Surface Analysis – Detecting the Defects with Laser Solutions

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Semiconductors need to be inspected during every part of the manufacturing process for defects. Accurate and precise results are critical to prevent unnecessary product wastage and cost. Within industrial, in-line applications, there are numerous challenges faced by customers and this paper looks at solutions to these challenges.

LEF 2020

LEF is the industry meeting point for representatives from business and science. For the 23rd time in 2020, the latest trends and developments related to the topic of laser micromachining will be presented in Fürth and discussed with regard to their application for various fields of application. 

LEF 2020 will focus on the following topics:

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