Process monitoring

(Lower left) A laser makes a hole in a material. (Upper left) The fluence of the laser is measured. (Lower right) Measurements of the fluence and the hole depth are superimposed. (Upper right) The relationship between these measurements is then determined so that hole depth can be calculated based solely on the fluence. (Image: Sakurai et al.)

Researchers devise low-cost process monitoring technique

The method was developed using a laser microscope and a Raspberry Pi Camera

Wafer Surface Analysis – Detecting the Defects with Laser Solutions

This article is brought to you by: 

Semiconductors need to be inspected during every part of the manufacturing process for defects. Accurate and precise results are critical to prevent unnecessary product wastage and cost. Within industrial, in-line applications, there are numerous challenges faced by customers and this paper looks at solutions to these challenges.

Pages

Navigation

Navigation

Navigation

Navigation

Navigation

Navigation

Subscribe to RSS - Process monitoring