UV

Laser technologies will have to continue to evolve to keep up with the need of the electronics industry. (Image: Shutterstock/raigvi)

Opportunities and challenges for laser technology in the electronics sector

Electronics manufacturing presents both significant opportunities and formidable challenges for developers of laser materials processing technologies, writes James Bakewell

Jim Bovatsek, applications engineering manager for MKS Spectra-Physics, shares how UV picosecond lasers can effectively cut layered stacks of organic polymers in flexible OLED display production

Precision laser cutting of OLED polymer stacks for bendable displays

Jim Bovatsek of MKS Spectra-Physics, shares how UV picosecond lasers can effectively cut layered stacks of organic polymers in flexible OLED display production

Orbotech introduces UV laser drilling machines for R2R flexible printed circuit manufacturing

Orbotech has introduced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations of electronic devices, including 5G smartphones, advanced automotive and medical devices. Orbotech's innovative roll-to-roll solutions for direct imaging (DI) and UV laser drilling overcome many of the yield, throughput and quality challenges inherent in flex material manufacturing.

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